GOLD BUMP CLEANER
It has been recognized as the best cleaning chemical to clean up foreign and contamination of the gold bumping surface
used in TCP(Tape Carrier Package), COG (Chip on Glass), and COF (Chip on Film) packages.
Au Bump Cleaner
(pre-Cleaning Chemical before EDS)
MSC 100 and 200 is a recovery chemical of gold surface which is contaminated with the process of Au Bump plating, Dry or Wet Etching process, Diffusion, etc..
Those are an effective cleaning method and adhesion promoter to remove oxide and a residue of gold surface.
Those are recommended for cleaning the surface of gold prior to further processing such as Probing Test (EDS), Wire Bonding, Soldering.
