GOLD BUMP CLEANER
This product is recognized as the most effective cleaner for removing foreign particles and contaminants from gold-plated surfaces used in TCP (Tape Carrier Package), COG (Chip-on-Glass), and COF (Chip-on-Film) packages.
Au Bump Cleaner
(pre-Cleaning Chemical before EDS)
MSC 100 and 200 is a recovery chemical
to restore gold surfaces contaminated by processes such as gold bump plating, dry or wet etching, and diffusion.
These products serve as effective cleaners and adhesion promoters, removing oxides and residues from gold surfaces.
It is recommended for cleaning gold surfaces prior to subsequent processes such as probing tests (EDS), wire bonding, and soldering.
